Xilinx XCV300E-6FG256I

Part points

• The XCV300E-6FG256I chip is a high-capacity FPGA (Field Programmable Gate Array) manufactured by Xilinx. It offers 297,600 logic cells, 4,320 Kbits of block RAM, and 576 multipliers. This chip provides flexible and programmable logic functions. It operates at a frequency of up to 190 MHz, making it suitable for various applications in industries like telecommunications, industrial automation, and aerospace.

• Equivalent

  There are no direct equivalent products of the XCV300E-6FG256I chip from Xilinx. However, the Xilinx Virtex-4 series, such as the XC4VLX15-10FF1148C, offers similar capabilities with a comparable package and pin count.

• Features

  The XCV300E-6FG256I is a field-programmable gate array (FPGA) with 300,000 system gates, 14,820 logic cells, and 176 input/output (I/O) pins. It has a 6-speed grade, operating up to 200MHz. It offers 256-ball fine-grid flip-chip CPGA packaging and is ideal for implementation in various applications such as telecommunications, automotive, and industrial sectors.

• Pinout

  The XCV300E-6FG256I is an integrated circuit FPGA with a pin count of 256. The function of this device is to provide programmable logic capacity for various digital applications, such as data processing, signal processing, and control systems.

• Manufacturer

  The XCV300E-6FG256I is manufactured by Xilinx, Inc. It is a multinational technology company that specializes in the development and production of programmable logic devices and associated software tools.

• Application Field

  The XCV300E-6FG256I is commonly used in applications requiring field-programmable gate arrays (FPGAs) with medium-sized logic capacity. It finds applications in areas such as telecommunications, data networking, digital signal processing, aerospace, automotive, industrial automation, and consumer electronics.

• Package

  The XCV300E-6FG256I chip is in a 256-pin fine pitch Ball Grid Array (BGA) package.