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$5000Xilinx XCV800-5BG560I
Virtex® Field Programmable Gate Array (FPGA) IC 404 114688 21168 560-LBGA Exposed Pad, Metal
Brands: AMD Xilinx, Inc
Mfr.Part #: XCV800-5BG560I
Datasheet: XCV800-5BG560I Datasheet (PDF)
Package/Case: BGA-560
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,991 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCV800-5BG560I General Description
Virtex® Field Programmable Gate Array (FPGA) IC 404 114688 21168 560-LBGA Exposed Pad, Metal
Features
- Logic Cells: 768,000
- System Gates: 5,292,480
- Block RAM: 3,456 Kbits
- DSP Slices: 864
- Maximum Number of User I/Os: 560
Application
- Intel FPGA Stratix V GX FPGA
- Microchip PolarFire MPF500T FPGA
- Lattice Semiconductor ECP5 FPGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer | Xilinx Inc. | Product Category | Embedded - FPGAs (Field Programmable Gate Array) |
| Series | VirtexR | Package-Case | 560-LBGA, Metal |
| Operating-Temperature | -40°C ~ 100°C (TJ) | Mounting-Type | Surface Mount |
| Voltage-Supply | 2.375 V ~ 2.625 V | Supplier-Device-Package | 560-MBGA (42.5x42.5) |
| Number-of-Gates | 888439 | Number-of-I-O | 404 |
| Number-of-LABs-CLBs | 4704 | Number-of-Logic-Elements-Cells | 21168 |
| Total-RAM-Bits | 114688 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCV800-5BG560I chip is a programmable logic device (PLD) manufactured by Xilinx. It belongs to the Virtex FPGA family and consists of 800,000 available system gates. The chip offers advanced performance and flexibility for a wide range of applications. Its package type is a BGA with 560 pins.
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Equivalent
Some equivalent products of the XCV800-5BG560I chip are XCV800-5BG432C, XCV800-5BG432CND, XCV800-5BG432-I, XCV800-5BG432-I/0542, and XCV800-5BG432-I/0404. -
Features
The XCV800-5BG560I is an integrated circuit with a capacity of 800,000 System Gates. It operates on a 5V power supply and is built with CMOS technology. It features a 560-pin BGA package, making it suitable for high-density applications. In addition, it offers various user I/O options and has a convenient programmable interface. -
Pinout
The XCV800-5BG560I is an integrated circuit, specifically a Field Programmable Gate Array (FPGA), with a pin count of 560. The exact pin functions and layout can be found in the manufacturer's datasheet for more detailed information. -
Manufacturer
The manufacturer of the XCV800-5BG560I is Xilinx Inc. Xilinx is a leading American technology company specializing in the development and production of programmable logic devices and associated software tools. They provide solutions for various industries including aerospace, automotive, telecommunications, and consumer electronics. -
Application Field
The XCV800-5BG560I is commonly used in areas such as aerospace and defense, telecommunications, automotive, and industrial applications. It can be utilized for tasks in high-performance computing, signal processing, image and video processing, and embedded systems, among other applications requiring a high level of computational power and flexibility. -
Package
The XCV800-5BG560I chip is a BGA package type, with a 560-ball grid array. It has a form factor and size compatible with Ball Grid Array packaging standards.
Datasheet PDF
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