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$5000LFXP2-8E-5FTN256C
Low power consumption
Brands: Lattice Semiconductor Corporation
Mfr.Part #: LFXP2-8E-5FTN256C
Datasheet: LFXP2-8E-5FTN256C Datasheet (PDF)
Package/Case: 256-LBGA
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 8,505 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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LFXP2-8E-5FTN256C General Description
Lattice Semiconductor's LFXP2-8E-5FTN256C is a formidable FPGA designed to meet the demands of modern high-performance applications. Featuring 8,192 LUTs, 193 user I/Os, and 238 I/Os, this device offers a comprehensive set of resources for complex design requirements. With a 256-pin FBGA package, the FPGA ensures secure and reliable connectivity, making it suitable for a diverse range of industrial and commercial applications. Operating at a 1.2V core voltage and supporting a variety of I/O standards, including LVCMOS, LVTTL, and LVDS, the LFXP2-8E-5FTN256C provides flexibility and compatibility with different interface needs. Moreover, the inclusion of PLLs, block RAM, and dedicated multipliers enhances its signal processing and data manipulation capabilities, catering to the needs of advanced applications. Programmed using the intuitive Lattice Diamond design software, the FPGA offers a seamless and efficient development process, ensuring quick integration into various systems. With its advanced features and robust construction, the LFXP2-8E-5FTN256C stands as a reliable and powerful choice for engineers and developers seeking a high-performance FPGA solution
Features
- Fully supports PowerPC™ 60x bus protocol, include PowerPC 603, 604, 740, 750 and 8260.
- Supports up to eight PowerPC bus masters with unlimited slave device support.
- Supports two outstanding bus accesses.
- Supports address only transfer and address bus retry.
- Independent address bus and data bus tenure with separate bus grant and data bus grant.
- Option for fixed priority assignment or rotating priority scheme.
- Designed for ASIC or programmable logic device implementations in various system environments.
- Fully static design with edge triggered flip-flops.
- Optimized for ispXPGA product family.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Series | XP2 | Package | Tray |
| Product Status | Active | Programmabe | Not Verified |
| Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 226304 | Number of I/O | 201 |
| Voltage - Supply | 1.14V ~ 1.26V | Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The LFXP2-8E-5FTN256C is a low-power, low-cost FPGA chip from Lattice Semiconductor, featuring 2,520 LUTs, 39 kbits of embedded memory, and 16 multibit arithmetic blocks. It offers high reliability and performance for various applications such as industrial control, automotive, and communications. With its small form factor and low power consumption, it is suitable for battery-operated and compact devices.
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Equivalent
The equivalent products of LFXP2-8E-5FTN256C chip are the following: LFE2-6E, LFE2-15E, and LFE2-35E FPGAs from Lattice Semiconductor. These chips have similar features and performance characteristics, making them suitable replacements for the LFXP2-8E-5FTN256C chip. -
Features
- Lattice XP2 series FPGA - 8K LUTs - 200 MHz - Flash technology - 144 I/O pins - 32 Kbit embedded block RAM - 256-ball fine pitch BGA package - Low power consumption - Programming and reconfiguration through JTAG - High reliability and security features -
Pinout
The LFXP2-8E-5FTN256C is a Lattice FPGA with 256-pin in a 14x14 mm package. It has 8,000 LUTs, 18 I/O banks, 2.5 Mbit embedded memory, and PLLs. The pins are used for power, ground, configuration, I/O, clock input, and other functions to support programmable logic design. -
Manufacturer
The LFXP2-8E-5FTN256C is manufactured by Lattice Semiconductor Corporation. Lattice Semiconductor Corporation is a global semiconductor company that designs and produces programmable logic devices and related software. They specialize in low-power, small form-factor programmable logic devices for a variety of applications in the consumer, communications, and industrial markets. -
Application Field
The LFXP2-8E-5FTN256C is commonly used in industrial control systems, communication equipment, automotive electronics, and consumer electronics. It is ideal for applications that require low power consumption, high performance, and integration of multiple functions in a compact package. Its flexibility and programmability make it suitable for a wide range of embedded applications. -
Package
The LFXP2-8E-5FTN256C chip is a Field Programmable Gate Array (FPGA) packaged in a 256-pin FineLine BGA form. It has a package size of 17x17mm.
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