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$5000Xilinx XC2S200-6FGG456C
XC2S200-6FGG456C: Field-Programmable Gate Array XC2S200-5FGG456C
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Brands: AMD Xilinx, Inc
Mfr.Part #: XC2S200-6FGG456C
Datasheet: XC2S200-6FGG456C Datasheet (PDF)
Package/Case: BGA456
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,735 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC2S200-6FGG456C General Description
Spartan®-II Field Programmable Gate Array (FPGA) IC 284 57344 5292 456-BBGA
![xc2s200-6fgg456c xc2s200-6fgg456c](/files/uploads/product/b/xc2s200-6fgg456c20171027200028_8110.jpg)
Features
- It has 200,000 system gates with 2,624 logic cells, 2.1 Mb of internal RAM, and 360 dedicated multipliers.
- The device operates at a maximum clock frequency of 175 MHz and has a total of 472 user I/O pins.
- It is built using a 0.18 µm CMOS process and is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.
Application
- The XC2S200-6FGG456C is suitable for a wide range of applications, including industrial control, automotive, aerospace, defense, telecommunications, and consumer electronics.
- It can be used to implement digital signal processing (DSP), image processing, encryption/decryption, network processing, and other complex functions.
- Its high-speed and high-density capabilities make it ideal for applications that require high performance and low power consumption.
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Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC2S200 |
Number of Logic Elements: | 5292 LE | Adaptive Logic Modules - ALMs: | 2352 ALM |
Embedded Memory: | 56 kbit | Number of I/Os: | 284 I/O |
Supply Voltage - Min: | 2.375 V | Supply Voltage - Max: | 2.625 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Data Rate: | - | Number of Transceivers: | - |
Mounting Style: | SMD/SMT | Package / Case: | FBGA-456 |
Brand: | Xilinx | Distributed RAM: | 75264 bit |
Embedded Block RAM - EBR: | 56 kbit | Maximum Operating Frequency: | 200 MHz |
Moisture Sensitive: | Yes | Number of Gates: | 200000 |
Number of Logic Array Blocks - LABs: | 1176 LAB | Operating Supply Voltage: | 2.5 V |
Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
Subcategory: | Programmable Logic ICs | Tradename: | Spartan |
Unit Weight: | 1.694886 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC2S200-6FGG456C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC2S200-6FGG256C
Brands :
Package : BGA256
Description : 200000 SYSTEM GATE 2.5 VOLT LOGIC CELL A - NOT RECOMMENDED for NEW DESIGN
Part Number : XC2S200-6FGG320C
Brands :
Package :
Description :
Part Number : XC2S200-6FGG456I
Brands :
Package : FBGA-456
Description : FPGA Spartan?-II Family 200K Gates 5292 Cells 263MHz 0.18um Technology 2.5V 456-Pin FBGA
Part Number : XC2S200-6FGG456I-C
Brands :
Package :
Description :
Part Number : XC2S200-6FGG456CES
Brands :
Package :
Description :
Part Number : XC2S200-6FGG456I-ES
Brands :
Package :
Description :
Part Number : XC2S200-6FGG456CES-J
Brands :
Package :
Description :
Part points
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The XC2S200-6FGG456C is a programmable logic device chip manufactured by Xilinx. It belongs to the Spartan-2 family and offers 200,000 gates. The chip operates with a supply voltage of 3.3V and comes in a Fine-Pitch Ball Grid Array package with 456 pins. It is widely used in various applications such as telecommunications, automotive, industrial, and consumer electronics for its high performance and programmability.
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Equivalent
Some equivalent products to the XC2S200-6FGG456C chip are XC2S200-5FGG456C, XC2S200-4FGG256C, and XC2S200-6FGG256C. -
Features
The XC2S200-6FGG456C is a Field-Programmable Gate Array (FPGA) from Xilinx. It has 200,000 system gates and 6 speed grades (-6). The package is Fine-Pitch Ball Grid Array (FGGA) with 456 pins. -
Pinout
The XC2S200-6FGG456C is a Field-Programmable Gate Array (FPGA) with a pin count of 456. It is a part of the Xilinx Spartan-II Series and has a maximum operating speed of 6 Megahertz. The specific functions of the pins can be found in the device's datasheet. -
Manufacturer
The manufacturer of the XC2S200-6FGG456C is Xilinx. Xilinx is a technology company specializing in the development and production of field-programmable gate array (FPGA) semiconductor devices. They provide programmable platforms and solutions for various applications in industries such as aerospace, automotive, telecommunications, and more. -
Application Field
The XC2S200-6FGG456C is an FPGA (Field-Programmable Gate Array) that can be used in various application areas such as industrial control systems, network routers, automotive electronics, medical devices, and aerospace applications. Its high-performance capabilities, low-power consumption, and flexible reconfiguration make it suitable for a wide range of applications. -
Package
The XC2S200-6FGG456C chip is a Field-Programmable Gate Array (FPGA) chip. It has a Fine-Pitch Ball-Grid Array (FBGA) package type with a size of 456 balls. Its form factor is small and compact.
Datasheet PDF
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