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Xilinx XC2S200-6FGG456C

XC2S200-6FGG456C: Field-Programmable Gate Array XC2S200-5FGG456C

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC2S200-6FGG456C

Datasheet: XC2S200-6FGG456C Datasheet (PDF)

Package/Case: BGA456

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,735 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC2S200-6FGG456C or email to us: Email: [email protected], we will contact you within 12 hours.

XC2S200-6FGG456C General Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 284 57344 5292 456-BBGA

xc2s200-6fgg456c

Features

  • It has 200,000 system gates with 2,624 logic cells, 2.1 Mb of internal RAM, and 360 dedicated multipliers.
  • The device operates at a maximum clock frequency of 175 MHz and has a total of 472 user I/O pins.
  • It is built using a 0.18 µm CMOS process and is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package.

Application

  • The XC2S200-6FGG456C is suitable for a wide range of applications, including industrial control, automotive, aerospace, defense, telecommunications, and consumer electronics.
  • It can be used to implement digital signal processing (DSP), image processing, encryption/decryption, network processing, and other complex functions.
  • Its high-speed and high-density capabilities make it ideal for applications that require high performance and low power consumption.
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC2S200
Number of Logic Elements: 5292 LE Adaptive Logic Modules - ALMs: 2352 ALM
Embedded Memory: 56 kbit Number of I/Os: 284 I/O
Supply Voltage - Min: 2.375 V Supply Voltage - Max: 2.625 V
Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C
Data Rate: - Number of Transceivers: -
Mounting Style: SMD/SMT Package / Case: FBGA-456
Brand: Xilinx Distributed RAM: 75264 bit
Embedded Block RAM - EBR: 56 kbit Maximum Operating Frequency: 200 MHz
Moisture Sensitive: Yes Number of Gates: 200000
Number of Logic Array Blocks - LABs: 1176 LAB Operating Supply Voltage: 2.5 V
Product Type: FPGA - Field Programmable Gate Array Factory Pack Quantity: 1
Subcategory: Programmable Logic ICs Tradename: Spartan
Unit Weight: 1.694886 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

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Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC2S200-6FGG456C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC2S200-6FGG256C

Brands :  

Package :   BGA256

Description :   200000 SYSTEM GATE 2.5 VOLT LOGIC CELL A - NOT RECOMMENDED for NEW DESIGN

Part Number :   XC2S200-6FGG320C

Brands :  

Package :  

Description :  

Part Number :   XC2S200-6FGG456I

Brands :  

Package :   FBGA-456

Description :   FPGA Spartan?-II Family 200K Gates 5292 Cells 263MHz 0.18um Technology 2.5V 456-Pin FBGA

Part Number :   XC2S200-6FGG456I-C

Brands :  

Package :  

Description :  

Part Number :   XC2S200-6FGG456CES

Brands :  

Package :  

Description :  

Part Number :   XC2S200-6FGG456I-ES

Brands :  

Package :  

Description :  

Part Number :   XC2S200-6FGG456CES-J

Brands :  

Package :  

Description :  

Part points

  • The XC2S200-6FGG456C is a programmable logic device chip manufactured by Xilinx. It belongs to the Spartan-2 family and offers 200,000 gates. The chip operates with a supply voltage of 3.3V and comes in a Fine-Pitch Ball Grid Array package with 456 pins. It is widely used in various applications such as telecommunications, automotive, industrial, and consumer electronics for its high performance and programmability.
  • Equivalent

    Some equivalent products to the XC2S200-6FGG456C chip are XC2S200-5FGG456C, XC2S200-4FGG256C, and XC2S200-6FGG256C.
  • Features

    The XC2S200-6FGG456C is a Field-Programmable Gate Array (FPGA) from Xilinx. It has 200,000 system gates and 6 speed grades (-6). The package is Fine-Pitch Ball Grid Array (FGGA) with 456 pins.
  • Pinout

    The XC2S200-6FGG456C is a Field-Programmable Gate Array (FPGA) with a pin count of 456. It is a part of the Xilinx Spartan-II Series and has a maximum operating speed of 6 Megahertz. The specific functions of the pins can be found in the device's datasheet.
  • Manufacturer

    The manufacturer of the XC2S200-6FGG456C is Xilinx. Xilinx is a technology company specializing in the development and production of field-programmable gate array (FPGA) semiconductor devices. They provide programmable platforms and solutions for various applications in industries such as aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC2S200-6FGG456C is an FPGA (Field-Programmable Gate Array) that can be used in various application areas such as industrial control systems, network routers, automotive electronics, medical devices, and aerospace applications. Its high-performance capabilities, low-power consumption, and flexible reconfiguration make it suitable for a wide range of applications.
  • Package

    The XC2S200-6FGG456C chip is a Field-Programmable Gate Array (FPGA) chip. It has a Fine-Pitch Ball-Grid Array (FBGA) package type with a size of 456 balls. Its form factor is small and compact.

Datasheet PDF

Preliminary Specification XC2S200-6FGG456C PDF Download

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