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$5000Xilinx XC2VP20-6FF896C
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC2VP20-6FF896C
Datasheet: XC2VP20-6FF896C Datasheet (PDF)
Package/Case: BGA896
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,828 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC2VP20-6FF896C General Description
Virtex®-II Pro Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA
Features
- It has a capacity of 19,008 logic cells and 640 DSP slices.
- It has 1.2 million system gates and 39,600 CLB flip-flops.
- It operates on a core voltage of 1.0V to 1.2V and has a maximum frequency of 500 MHz.
- It has 20 high-speed serial transceivers with a data rate of up to 3.2 Gbps.
Application
- Aerospace and defense systems
- Broadcast and communication systems
- Industrial automation and control systems
- Medical imaging and diagnostics
- Test and measurement equipment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| Product: | Virtex-II Pro | Number of Logic Elements: | 20880 |
| Number of I/Os: | 556 I/O | Operating Supply Voltage: | 1.5 V |
| Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
| Mounting Style: | SMD/SMT | Package / Case: | FBGA-896 |
| Data Rate: | 6.25 Gb/s | Series: | XC2VP20 |
| Brand: | Xilinx | Distributed RAM: | 290 kbit |
| Embedded Block RAM - EBR: | 1584 kbit | Maximum Operating Frequency: | 350 MHz |
| Number of Transceivers: | 8 Transceiver | Product Type: | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
| Tradename: | Virtex | Tags | XC2VP20-6FF8, XC2VP20-6FF, XC2VP20-6F, XC2VP20-6, XC2VP20, XC2VP2, XC2VP, XC2V, XC2 |
| Mfr | AMD | Series | Virtex®-II Pro |
| Package | Tray | Product Status | Obsolete |
| Programmabe | Not Verified | Number of LABs/CLBs | 2320 |
| Number of Logic Elements/Cells | 20880 | Total RAM Bits | 1622016 |
| Number of I/O | 556 | Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount | Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 896-BBGA, FCBGA | Supplier Device Package | 896-FCBGA (31x31) |
| Base Product Number | XC2VP20 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC2VP20-6FF896C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC2VP20-5FF896C
Brands :
Package : FBGA896
Description : 20880 LOGIC CELLS 8 ROCKET IOS 2 POWER P FPGA
Part Number : XC2VP20-7FF896C
Brands :
Package : 896-BBGA, FCBGA
Description : 20880 Logic Cells 8 Rocket IOs 2 Power P
Part Number : XC2VP20-4FF896C
Brands :
Package :
Description :
Part Number : XC2VP20-FF896C
Brands :
Package :
Description :
Part points
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The XC2VP20-6FF896C is a Field Programmable Gate Array (FPGA) chip developed by Xilinx. It belongs to the Virtex-II Pro series and features 20,000 logic cells, 896 user I/Os, and a maximum operating frequency of 200 MHz. The chip supports a range of advanced features and is commonly used in applications that require high-performance digital signal processing and configurable logic functionality.
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Features
The XC2VP20-6FF896C is a field programmable gate array (FPGA) with 20,208 logic cells, 448 I/O pins, and 360 DSP48E slices. It uses 65nm process technology and has a total internal storage capacity of 5.4Mb. It offers versatile digital signal processing capabilities and is widely used in various applications such as telecommunications, video processing, and high-performance computing. -
Pinout
The XC2VP20-6FF896C is an FPGA device from Xilinx. It has a pin count of 896 and supports a variety of functions, including logic processing, digital signal processing, and embedded computing. -
Manufacturer
The manufacturer of the XC2VP20-6FF896C is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx offers solutions for various industries, including automotive, communications, aerospace, and defense. -
Application Field
The XC2VP20-6FF896C is an FPGA device manufactured by Xilinx. It can be used in various application areas such as aerospace and defense, automotive, industrial automation, scientific research, and telecommunications. Its high-performance capabilities and reprogrammable nature make it suitable for applications requiring real-time processing, signal processing, and high-speed data communication. -
Package
The XC2VP20-6FF896C chip is packaged in a Fine-Pitch Ball Grid Array (FBGA) package. It has a 896-pin count and its form factor is 23mm x 23mm.
Datasheet PDF
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