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$5000Xilinx XC7Z035-1FBG676C
Development demonstration product
Brands: Xilinx
Mfr.Part #: XC7Z035-1FBG676C
Datasheet: XC7Z035-1FBG676C Datasheet (PDF)
Package/Case: FCBGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3,194 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7Z035-1FBG676C General Description
The XC7Z035-1FBG676C is a powerhouse of a product within the Xilinx Zynq-7000 family, combining the processing might of a dual-core ARM Cortex-A9 with the versatility of Xilinx 7-series FPGA fabric. Boasting a clock speed of 1.0 GHz, this device is tailored for demanding embedded applications that require substantial computational prowess. Its impressive 75,000 logic cells and 80 DSP slices offer a wide range of customization options for implementing complex logic and signal processing algorithms. Moreover, the FPGA fabric supports a variety of interfaces such as Gigabit Ethernet, USB, PCIe, and CAN, ensuring seamless connectivity within diverse embedded systems. With 512 KB of L2 cache for efficient processor operation and 32 KB of on-chip RAM for FPGA fabric usage, the XC7Z035-1FBG676C is designed for optimal performance. Additionally, its multiple high-speed transceivers enable high-bandwidth data communication, making it a valuable asset for industries like industrial automation, automotive, aerospace, and telecommunications
Features
IC SOC CORTEX-A9 KINTEX7 676BGAIC SOC CORTEX-A9 KINTEX7 676BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FCBGA | Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount | Core Architecture | ARM |
| Frequency | 667 MHz | Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Operating Temperature | 85 °C | Max Supply Voltage | 1.05 V |
| Min Operating Temperature | 0 °C | Min Supply Voltage | 950 mV |
| Number of I/Os | 130 | Number of Registers | 343800 |
| Peripherals | DMA | Propagation Delay | 120 ps |
| RAM Size | 250 kB |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7Z035-1FBG676C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Zynq-7000 family of FPGAs and features a dual-core ARM Cortex-A9 processor along with programmable logic. The chip offers a combination of software programmability and hardware customization, making it suitable for a wide range of applications including embedded systems, automotive electronics, and industrial automation.
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Features
The XC7Z035-1FBG676C is a System on Chip (SoC) that combines a dual-core ARM Cortex-A9 processor with a programmable logic fabric. It features a 7 series FPGA, has 198K logic cells, 5,200 slices, and 4.9 MB of block RAM. It also includes high-speed connectivity interfaces and is designed for applications in embedded processing, networking, automotive, and more. -
Pinout
The pin count of the XC7Z035-1FBG676C is 676. It is a System on Chip (SoC) device from Xilinx with a function that combines an ARM Cortex-A9 MPCore processor with Xilinx 7-series field-programmable gate array (FPGA) fabric, enabling flexibility and integration of both processing and customizable logic capabilities. -
Manufacturer
The manufacturer of the XC7Z035-1FBG676C is Xilinx Inc. It is an American technology company known for designing and manufacturing programmable logic devices and software tools for the development of digital and mixed-signal systems. -
Application Field
The XC7Z035-1FBG676C is an FPGA (Field Programmable Gate Array) from Xilinx. It is commonly used in applications such as high-performance computing, data centers, industrial control systems, aerospace and defense, and automotive electronics. Its versatile architecture and advanced features make it suitable for various industries requiring flexible and customizable hardware solutions. -
Package
The XC7Z035-1FBG676C chip belongs to the XC7Z family of programmable logic devices manufactured by Xilinx. It comes in a 676-pin fine ball grid array (FBG676) package with a size of 27mm x 27mm.
Datasheet PDF
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