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Xilinx XCZU2EG-1SFVC784E

The XCZU2EG-1SFVC784E is a cutting-edge FPGA from the Zynq® UltraScale family, boasting an impressive 103320 cells and utilizing 20nm technology

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Brands: AMD Xilinx, Inc

Mfr.Part #: XCZU2EG-1SFVC784E

Datasheet: XCZU2EG-1SFVC784E Datasheet (PDF)

Package/Case: FBGA-784

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2,359 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XCZU2EG-1SFVC784E General Description

The XCZU2EG-1SFVC784E is a standout member of Xilinx's Zynq UltraScale+ MPSoC family, offering a highly integrated and flexible platform for diverse applications in automotive, industrial, aerospace, and defense sectors. Its combination of programmable logic and processing system includes a dual-core ARM Cortex-A53 processing system, a dual-core ARM Cortex-R5 real-time processing system, a Mali-400 MP2 GPU, and UltraScale+ programmable logic with 60,400 logic cells and 2,760 DSP slices. Additionally, it boasts 4 GB of DDR4 memory, 64 MB of QSPI flash memory, and various connectivity options such as Gigabit Ethernet, USB, PCIe, and SATA. Packaged in a 784-pin flip-chip BGA package and designed for industrial temperature range operation, the XCZU2EG-1SFVC784E is engineered to deliver high levels of integration, reliability, and performance in demanding environments

Features

SoC FPGA XCZU2EG-1SFVC784ESoC FPGA XCZU2EG-1SFVC784E
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pin Count 784 Package Category BGA
Released Date Jun 23, 2020

Shipping

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TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

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Credit Card Credit Card charge 3.5% service fee.
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Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

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    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCZU2EG-1SFVC784E chip is a member of Xilinx's Zynq UltraScale+ RFSoC (radio frequency system-on-chip) family. It combines programmable logic, processing system, analog-to-digital converters, and digital-to-analog converters on a single chip. The XCZU2EG-1SFVC784E chip specifically offers 2.8 million logic cells, 360Mb of UltraRAM, 1,086 DSP slices, and integrated RF data converters, making it suitable for applications in wireless communications, 5G, radar, and satellite systems.
  • Features

    The XCZU2EG-1SFVC784E is a Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) from Xilinx. It features a processing system with dual-core Arm Cortex-A53 processors and an FPGA fabric with programmable logic. It also includes high-speed interfaces, memory interfaces, integrated peripherals, and specialized accelerators, making it suitable for a wide range of applications in industries such as automotive, industrial automation, and telecommunications.
  • Pinout

    The XCZU2EG-1SFVC784E is an FPGA device with a pin count of 784. It belongs to the Zynq UltraScale+ family and has various functions, including programmable logic, processing system, and high-speed transceivers.
  • Manufacturer

    XCZU2EG-1SFVC784E is manufactured by Xilinx. Xilinx is a leading semiconductor company known for designing and producing programmable logic devices and associated technologies. They are renowned for their field-programmable gate arrays (FPGAs) and system-on-chip (SoC) solutions, serving a wide range of industries such as aerospace, automotive, telecommunications, and more.
  • Application Field

    The XCZU2EG-1SFVC784E is a field-programmable gate array (FPGA) designed by Xilinx. It is commonly used in applications such as video encoding and decoding, software-defined networking, advanced driver-assistance systems (ADAS), as well as machine learning and artificial intelligence (AI) implementations.
  • Package

    The XCZU2EG-1SFVC784E chip has a package type of Flip-Chip Ball Grid Array (FCBGA), a form factor of 784-pin ceramic package, and a size that is determined by the specific dimensions of the FCBGA package.

Datasheet PDF

Preliminary Specification XCZU2EG-1SFVC784E PDF Download

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