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Xilinx XCZU15EG-1FFVB1156I

This high-density SoC FPGA offers exceptional processing capabilities

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCZU15EG-1FFVB1156I

Datasheet: XCZU15EG-1FFVB1156I Datasheet (PDF)

Package/Case: FCBGA-1156

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3,287 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XCZU15EG-1FFVB1156I or email to us: Email: [email protected], we will contact you within 12 hours.

XCZU15EG-1FFVB1156I General Description

The XCZU15EG-1FFVB1156I by Xilinx is a powerhouse SoC device that combines a dual-core ARM Cortex-A53 processor, a quad-core ARM Cortex-R5 processor, and FPGA resources in a single chip. With 1.143M logic cells, 2,520 DSP slices, and 40.8Mb of Ultra RAM, this device is equipped to handle high-demand applications requiring extensive processing power and real-time capabilities

Features

XCZU15EG-1FFVB1156IXCZU15EG-1FFVB1156I
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Specifications

Parameter Value Parameter Value
Max Operating Temperature 100 °C Number of Transceivers 24
RAM Size 3.9 MB Speed Grade -1
Series Zynq® UltraScale+™ MPSoC EG Package Tray
Product Status Active Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328

Shipping

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DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCZU15EG-1FFVB1156I chip is a versatile field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Zynq UltraScale+ MPSoC family, combining FPGA capabilities with an Arm Cortex-A53 processor. The chip offers high-performance computing, low power consumption, and a wide range of applications in various industries such as aerospace, automotive, industrial automation, and more.
  • Features

    The XCZU15EG-1FFVB1156I is an FPGA device from Xilinx. It is built on a 16nm process technology and belongs to the Zynq UltraScale+ MPSoC family. It features a combination of programmable logic and processing system, offering high-performance processing, connectivity, and programmability. It has a high-speed serial interface for communication and various peripherals for system integration.
  • Pinout

    The XCZU15EG-1FFVB1156I is an FPGA from Xilinx with a pin count of 1156. It is designed to provide programmable logic functionality for various applications and features multiple I/O interfaces, including high-speed transceivers, memory controllers, and peripheral interfaces.
  • Manufacturer

    Triada designs and manufactures the XCZU15EG-1FFVB1156I. It is a semiconductor company specializing in the development of field-programmable gate arrays (FPGAs) and system-on-chip (SoC) solutions.
  • Application Field

    The XCZU15EG-1FFVB1156I is a Field-Programmable Gate Array (FPGA) integrated circuit used in various application areas such as data center accelerators, video and image processing, wireless communication, industrial automation, aerospace, and defense systems. Its advanced capabilities and versatility make it suitable for high-performance computing and low-latency applications.
  • Package

    The XCZU15EG-1FFVB1156I chip comes in a Ball Grid Array (BGA) package type, with the form of a flip-chip, and a size of 1156 pins.

Datasheet PDF

Preliminary Specification XCZU15EG-1FFVB1156I PDF Download

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