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$5000Xilinx XCZU11EG-L1FFVC1156I
XCZU11EG-L1FFVC1156I is a Zynq UltraScale+ RFSoC with Logic Cells 653K
Brands: AMD Xilinx, Inc
Mfr.Part #: XCZU11EG-L1FFVC1156I
Datasheet: XCZU11EG-L1FFVC1156I Datasheet (PDF)
Package/Case: FCBGA-1156
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3,234 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCZU11EG-L1FFVC1156I General Description
What sets the XCZU11EG-L1FFVC1156I apart is its integrated programmable logic fabric, boasting an impressive 192K logic cells, 2240 DSP slices, and 18.3 Mb of Block RAM. This allows for the acceleration of compute-intensive tasks with custom hardware, giving you the flexibility and power to optimize performance like never before
Features
SoC FPGA XCZU11EG-L1FFVC1156ISoC FPGA XCZU11EG-L1FFVC1156I
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Max Operating Temperature | 100 °C | Number of Transceivers | 16 |
| RAM Size | 2.8 MB |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCZU11EG-L1FFVC1156I is a highly advanced system on chip (SoC) from Xilinx's Zynq UltraScale+ family. It combines a powerful quad-core 64-bit ARM Cortex-A53 processor with programmable logic in a single device, making it ideal for high-performance applications in sectors such as aerospace, automotive, and telecommunications.
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Equivalent
Equivalent products of XCZU11EG-L1FFVC1156I chip include XCZU11EG-1FFVC1156I, XCZU11CG-L1FFVC1156I, and XCZU11CG-LFFVC1156I. These chips have similar features, performance, and compatibility for use in FPGA-based applications. -
Features
XCZU11EG-L1FFVC1156I is a Zynq UltraScale+ MPSoC with 8 ARM Cortex-A53 cores, Mali-400 MP2 GPU, 16nm FinFET+ processing technology, and 1.2V core voltage. It features 80 DSP slices with 2.4 TFLOPs of compute performance, 2.33 Mb of BRAM, 270K LUTs, and 652 Kb of UltraRAM. It also supports DDR4 memory, PCIe Gen3, and Gigabit Ethernet. -
Pinout
XCZU11EG-L1FFVC1156I is a RFSoC device with a pin count of 1156. It features a combination of programmable logic, ARM processors, and analog interfaces for high-speed data processing and connectivity in wireless systems. -
Manufacturer
XCZU11EG-L1FFVC1156I is manufactured by Xilinx, a technology company known for designing and producing programmable devices and associated technologies. Xilinx specializes in the development of field-programmable gate arrays (FPGAs) and has a strong presence in the semiconductor industry. -
Application Field
XCZU11EG-L1FFVC1156I is commonly used in applications such as data centers, networking, telecommunications, automotive, and aerospace. It is ideal for high-performance computing tasks, including image and signal processing, machine learning, and artificial intelligence. Its versatility and advanced features make it well-suited for a wide range of industrial and commercial applications. -
Package
The XCZU11EG-L1FFVC1156I chip is in a flip-chip ball grid array (FBGA) package with a size of 35mm x 35mm.
Datasheet PDF
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