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Xilinx XCZU6CG-2FFVB1156I 48HRS

System on Chip FPGA XCZU6CG-2FFVB1156I

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCZU6CG-2FFVB1156I

Datasheet: XCZU6CG-2FFVB1156I Datasheet (PDF)

Package/Case: FCBGA-1156

RoHS Status:

Stock Condition: 3,417 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $1763.362 $1763.362
30 $1688.213 $50646.390

In Stock: 3,417 PCS

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Quick Quote

Please submit RFQ for XCZU6CG-2FFVB1156I or email to us: Email: [email protected], we will contact you within 12 hours.

XCZU6CG-2FFVB1156I General Description

Not only does this sophisticated device come packed with processing power, but it also integrates a plethora of interfaces and peripherals such as high-speed serial transceivers, DDR4 memory controllers, Gigabit Ethernet, USB, and PCIe, ensuring seamless connectivity and interaction with external components

Features

SoC FPGA XCZU6CG-2FFVB1156ISoC FPGA XCZU6CG-2FFVB1156I
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: SoC FPGA
Shipping Restrictions: This product may require additional documentation to export from the United States. RoHS: Details
Mounting Style: SMD/SMT Package / Case: FCBGA-1156
Core: ARM Cortex A53, ARM Cortex R5 Number of Cores: 4 Core
Maximum Clock Frequency: 600 MHz, 1.5 GHz L1 Cache Instruction Memory: 2 x 32 kB, 2 x 32 kB
L1 Cache Data Memory: 2 x 32 kB, 2 x 32 kB Program Memory Size: -
Data RAM Size: - Number of Logic Elements: 469446 LE
Adaptive Logic Modules - ALMs: 26825.5 ALM Embedded Memory: 25.1 Mbit
Number of I/Os: 352 I/O Operating Supply Voltage: 850 mV
Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 100 C
Brand: Xilinx Distributed RAM: 6.9 Mbit
Embedded Block RAM - EBR: 25.1 Mbit Moisture Sensitive: Yes
Number of Logic Array Blocks - LABs: 26825.5 LAB Number of Transceivers: 24 Transceiver
Product Type: SoC FPGA Series: XCZU6CG
Factory Pack Quantity: 1 Subcategory: SOC - Systems on a Chip
Tradename: Zynq UltraScale+

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC chip from Xilinx, featuring a combination of FPGA fabric and ARM processor cores. It is designed for applications requiring high-performance processing, programmable logic, and integrated connectivity capabilities. The chip is ideal for a wide range of applications such as automotive, industrial automation, and networking.
  • Equivalent

    The equivalent products of the XCZU6CG-2FFVB1156I chip are Xilinx's Zynq UltraScale+ XCZU7CG-2FFVC1156I, XCZU6CG-2FFVB900I, XCZU5EV-1FFVC900I, and XCZU5CG-1FFVC900I chips. These chips belong to the Zynq UltraScale+ MPSoC family and offer similar features and capabilities for different performance and power requirements.
  • Features

    XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC with integrated FPGA and ARM processors, featuring 6 ARM Cortex-A53 cores, Mali-400 MP2 GPU, and a programmable logic capacity of 297K logic cells. It also includes 2.4Mb of Block RAM, 60Mb of UltraRAM, and interfaces like PCIe, Gigabit Ethernet, and USB.
  • Pinout

    The XCZU6CG-2FFVB1156I is a programmable System on Chip (SoC) with 1156 pins. It features a high-performance processing system, programmable logic, and integrated peripherals for a wide range of applications such as signal processing, networking, and industrial control.
  • Manufacturer

    XCZU6CG-2FFVB1156I is manufactured by Xilinx, which is a technology company specializing in the design and production of programmable logic devices. Xilinx is a leading provider of field-programmable gate arrays (FPGAs) and programmable System-on-Chip (SoC) solutions for a wide range of applications in industries such as automotive, aerospace, telecommunications, and data center.
  • Application Field

    The XCZU6CG-2FFVB1156I is a versatile SoC device commonly used in applications such as high-performance computing, data center acceleration, networking, and aerospace and defense systems. It is also used in industrial automation, automotive, and telecommunication equipment for its advanced processing capabilities and integrated features.
  • Package

    The XCZU6CG-2FFVB1156I chip is packaged in a Flip-Chip Ball Grid Array (FCBGA). It has a form factor of 35mm x 35mm and is in a size of 1156 pins.

Datasheet PDF

Preliminary Specification XCZU6CG-2FFVB1156I PDF Download

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